【太平洋科技-每日观点&资讯】（2025-03-20）

Market Performance - The main board led the gains with notable increases in stocks such as Gongda Electronics (+9.97%), Data Port (+6.08%), and Liding Optoelectronics (+5.23%) [1] - The ChiNext board saw significant growth, particularly in Tangyuan Electric (+17.96%) and Hengxin Oriental (+9.07%) [1] - The Sci-Tech Innovation board was led by Chuangyao Technology (+20.00%) and Gai Lun Electronics (+9.32%) [1] - The active sub-industry SW brand consumer electronics experienced a slight decline of -0.13% [1] Domestic News - Nuo Vision Technology has officially launched its Micro-LED micro-display chip production line, marking a significant breakthrough in industrialization within the Micro-LED field [1] - Chiplink Integrated has entered the "first tier" of wafer foundry, ranking among the top ten global dedicated wafer foundries in 2024, and is the fourth in mainland China [1] - ZTE Corporation released the Ai Cube DeepSeek integrated machine, providing efficient large model commercialization solutions for enterprises [1] - Tencent reported a capital expenditure of 76.7 billion yuan for the previous year, a 221% increase year-on-year, representing about 12% of its revenue [1] Company Announcements - Super Sonic Electronics reported a revenue of 5.756 billion yuan for 2024, a year-on-year increase of 5.48%, with a net profit of 218 million yuan, up 10.09% [2] - Yangjie Technology announced a suspension of trading as it actively progresses with plans to issue shares and pay cash for asset purchases [2] - Ankai Micro received approval to establish a postdoctoral research workstation, enhancing its research capabilities [2] - Zhenhua Wind Power disclosed a reduction of 5.56 million shares by a major shareholder, accounting for 2.78% of the total share capital [2] Overseas News - Apple is expected to continue using TSMC's N3P process for the A20 chip, delaying the adoption of 2nm technology [2] - OpenAI's joint venture for a $100 billion Stargate infrastructure will house up to 400,000 NVIDIA AI chips, with construction expected to complete by mid-2026 [2] - Microsoft and NVIDIA announced a series of AI collaborations at the GTC 2025 conference, enhancing their integrated services [2] - Solidigm introduced a liquid-cooled enterprise SSD at the GTC AI conference, expected to be applied in AI servers later this year [2]