Core Viewpoint - Suzhou Tianzhun Technology Co., Ltd. has announced the successful internal validation of its TB2000 wafer defect detection equipment, marking a significant milestone in the domestic production of advanced semiconductor detection equipment [1][2]. Group 1: Product Development and Capabilities - The TB2000 is capable of mass production defect detection for advanced processes of 14nm and below, following the TB1500's breakthrough at the 40nm node [2][3]. - The TB2000 utilizes a fully self-developed high-power wide-spectrum laser excitation plasma light source system, deep ultraviolet high-flux imaging system, high-frequency TDI camera, and ultra-precision high-speed motion platform, combined with AI image processing algorithms to enhance defect detection sensitivity and speed [2][3]. Group 2: Market Position and Strategy - With the launch of TB2000, Tianzhun becomes one of the few manufacturers globally capable of delivering bright field detection equipment for 14nm and below technology nodes, gradually achieving domestic substitution in advanced process defect detection equipment [3][7]. - Tianzhun's product matrix now covers all process nodes for bright field defect detection, with a complete system from TB1000/TB1100 (65-90nm), TB1500 (40nm), to TB2000 (14nm), meeting various customer needs in logic and storage processes [3][5]. Group 3: Industry Outlook - According to the World Semiconductor Association (WICA), the global semiconductor market is expected to reach $718.9 billion by 2025, growing by 13.2%, with the high-end detection equipment market for 14nm and below continuing to grow rapidly due to technological advancements and market demand [5][7]. - Tianzhun aims to build a technological moat covering key detection nodes in chip manufacturing, with a commitment to annual product iterations and continued investment in R&D to overcome technological barriers in the Chinese semiconductor industry [7].
突破14nm工艺检测壁垒:天准科技TB2000明场纳米图形晶圆缺陷检测装备开启国产缺陷检测新纪元