【太平洋科技-每日观点&资讯】（2025-04-01）

Market Overview - The main board led the gains with notable stocks such as Gongda Electronics (+10.03%), Xinyada (+10.01%), and Dazhihui (+9.99%) [1] - The ChiNext board saw significant increases with Hongjing Technology (+20.00%) and Saiyi Information (+19.99%) [1] - The Sci-Tech Innovation board was led by Changyang Technology (+15.11%) and Lexin Technology (+9.37%) [1] - Active sub-industries included SW Communication Application Value-Added Services (+1.37%) and SW Communication Engineering and Services (+1.05%) [1] Domestic News - TSMC announced the completion of structural engineering for its 2nm expansion project, with mass production expected in the second half of 2025 [1] - Hefei plans to establish a 10 billion yuan future industry fund to support the development of the smart robotics industry [1] - Longxin's 3C6000/D 2U dual-server features a 100% localization rate for core components, catering to general computing and large data centers [1] - BGI intends to acquire 100% of Chip and Semiconductor, enhancing its EDA solution capabilities [1] Company Announcements - Zhongkong Technology reported a total revenue of 9.139 billion yuan for 2024, a year-on-year increase of 6.02%, with a net profit of 1.117 billion yuan, up 1.38% [2] - Minexplosion Optoelectronics achieved a total revenue of 1.641 billion yuan in 2024, reflecting a 7.35% increase, with a net profit of 231 million yuan, up 0.17% [2] - Shanghai Beiling reported a total revenue of 2.819 billion yuan for 2024, a significant increase of 31.89%, with a net profit of 396 million yuan, up 756.82% [2] - Pufan Software's total revenue for 2024 reached 836 million yuan, a year-on-year growth of 11.6%, with a net profit of 121 million yuan, up 95.06% [2] International News - Toray Engineering launched large glass substrate packaging equipment capable of high-precision chip packaging [3] - Hanwha Semiconductor signed a supply agreement worth 21 billion KRW for thermal compression bonding machines with SK Hynix [3] - The Japanese government announced an additional subsidy of up to 802.5 billion yen for Rapidus, totaling 1.7 trillion yen in support for next-generation 2nm chip production [3] - Audi China is integrating Huawei's ADS intelligent driving system into its advanced vehicle platforms [3]