国际低温键合3D集成技术研讨会首次登录中国

Core Viewpoint - The article highlights the revolutionary development of 3D integration and advanced packaging driven by semiconductor bonding technology, with a focus on low-temperature bonding and integration [1][5]. Group 1: Event Overview - The 2025 China International Low Temperature Bonding 3D Integration Technology Seminar (LTB-3D 2025) will be held for the first time in China, organized by Qinghe Crystal and IMSI, bringing together international experts to discuss cutting-edge wafer bonding technologies and their industrial applications [1][3][5]. - The seminar will take place from August 3 to 4, 2025, in Tianjin, China, and aims to provide a platform for international cooperation and exchange in semiconductor integration technology [3][5]. Group 2: Technical Focus - LTB-3D 2025 will focus on core technologies such as low-temperature bonding, heterogeneous integration, and advanced packaging, aiming to align China's semiconductor industry with international standards [3][5]. - The workshop will cover advanced research areas related to low-temperature bonding technologies, including surface activated bonding (SAB) and atomic diffusion bonding (ADB), which enable novel device structures through heterogeneous material integration [5]. Group 3: Registration and Participation - The event is open for topic submissions and registration for global industry professionals, with an early-bird registration fee structure outlined [7][8]. - The registration fees vary by category, with early-bird rates for regular participants at RMB 3000, members at RMB 2400, and students at RMB 2000 [7].