玻璃基板，更近了

Core Viewpoint - The article discusses the emerging significance of glass substrates in advanced semiconductor packaging, highlighting their advantages over traditional resin substrates, particularly in high-density and high-performance applications for AI and data centers [2][4]. Group 1: Industry Developments - Samsung Electro-Mechanics is building a semiconductor glass substrate ecosystem to commercialize glass substrates and address technical challenges, planning to form alliances with multiple suppliers and technology partners [4]. - Samsung plans to initiate trial production of glass substrates at its Sejong factory in the second quarter, with mass production targeted for after 2027 [4][8]. - SKC has seen a significant stock price increase of 44.4% due to investor expectations regarding the commercialization of glass substrates, indicating a competitive landscape for early leadership in this market [6][8]. Group 2: Technical Advantages - Glass substrates offer superior thermal stability and mechanical stability, allowing for higher interconnect density and reduced power consumption, with potential performance improvements of up to 40% in semiconductor speed [5][7]. - The ability to create numerous copper channels on glass substrates enhances power efficiency, making them a preferred choice for next-generation semiconductor applications [5][7]. Group 3: Competitive Landscape - Major companies like Intel, AMD, and Broadcom are planning to adopt glass substrates in their next-generation chips, with Intel investing $1 billion in glass substrate development aiming for commercialization by 2030 [7]. - SKC's joint venture, Absolics, is positioned as a leading player in glass substrate technology, with plans for large-scale production by the end of the year [8]. Group 4: Challenges - The lack of standardized sizes, thicknesses, and characteristics for glass substrates poses significant challenges for manufacturers and semiconductor plants seeking compatibility with existing processes [10]. - Compatibility issues between different batches of glass substrates and their semiconductor devices must be addressed to ensure successful integration into advanced applications [10][11].