印度要发力1nm以下的芯片

Core Viewpoint - A team of 30 scientists from the Indian Institute of Science (IISc) has proposed the development of "angstrom-level" chips, significantly smaller than the current smallest chips, to enhance India's position in the semiconductor industry [1][2]. Group 1: Proposal Details - The proposal aims to develop chips using new semiconductor materials known as two-dimensional materials, which could reduce chip size to one-tenth of the current smallest chips produced globally [1]. - The current smallest chips are produced using 3-nanometer nodes by companies like Samsung and TSMC [1]. - The detailed project report (DPR) was initially submitted in April 2022 and revised for resubmission in October 2024, indicating ongoing governmental discussions [1][3]. Group 2: Government and Industry Response - The Indian Ministry of Electronics and Information Technology (MeitY) is positively inclined towards the project, exploring electronic applications for the proposed technology [2]. - India's semiconductor manufacturing heavily relies on foreign companies, making this project strategically significant for economic and national security [2]. - The largest semiconductor project in India, a collaboration between Tata Electronics and Taiwan's TSMC, has an investment of ₹910 billion and has received government approval for 50% funding support [2]. Group 3: Funding and Global Context - The IISc-led proposal requests ₹5 billion over five years for developing indigenous semiconductor technology, which is relatively modest compared to other global investments [2]. - Countries like Europe and South Korea have invested significantly in two-dimensional materials, with Europe exceeding $1 billion (approximately ₹83 billion) [2]. - The urgency for India to act is emphasized, as global tech companies are shifting focus towards two-dimensional semiconductors, and the window for India to execute this proposal may close soon [3].