聚焦AI智算芯片、芯片封装技术等热点话题NEPCON China 2025同期ICPF半导体技术和应用创新大会多位大咖亮相！

Core Viewpoint - The article highlights the upcoming IC Packaging Fair (ICPF) 2025, focusing on advancements in semiconductor packaging technologies and applications, scheduled for April 22-24, 2025, at the Shanghai World Expo Exhibition and Convention Center [1]. Event Overview - ICPF 2025 will feature over 30 semiconductor technology executives sharing insights during a three-day technical forum [1]. - The event aims to gather more than 1,000 industry elites to explore business opportunities in the semiconductor sector [1]. Technical Sessions - The agenda includes various presentations from industry leaders, such as: - Xie Jianfan, General Manager of Qili Semiconductor, discussing advancements in semiconductor technology [2]. - Wang Xin, CTO of Hangzhou Jingtong Technology, presenting on innovative applications [2]. - Hu Qingsong, Director of Guangdong Hongqi Chip Intelligent Equipment, sharing insights on equipment advancements [3]. Focus Areas - The event will cover critical topics such as: - 2.5D and 3D packaging technologies and their applications [1][7]. - Power semiconductor packaging techniques, including the use of silver sintering processes [16]. - System-level packaging innovations and challenges [7]. Networking Opportunities - ICPF 2025 will serve as a platform for networking among semiconductor professionals, fostering collaboration and knowledge sharing [1]. Additional Information - The event will also include a skills competition for semiconductor engineers, aimed at enhancing professional capabilities [1]. - Participants can register for the event by scanning a QR code provided in the promotional materials [6][15].