HBM设备，掀起内战！

Core Viewpoint - The competition in the semiconductor industry, particularly regarding the supply of Thermal Compression Bonding (TCB) machines, is intensifying as SK Hynix seeks to diversify its suppliers, challenging the long-standing relationship with Hanmi Semiconductor and introducing Hanwha Semiconductor as a competitor [1][2]. Group 1: Industry Dynamics - SK Hynix is diversifying its TCB machine suppliers, which is crucial for the production of High Bandwidth Memory (HBM) chips, leading to a power struggle in the South Korean semiconductor industry [1]. - Hanmi Semiconductor's entry into the TCB machine market has disrupted the industry and escalated tensions, resulting in legal disputes with Hanmi Semiconductor [1][2]. - Hanmi Semiconductor has withdrawn approximately 50 to 60 employees from SK Hynix's HBM production line, indicating a significant shift in operational dynamics [1]. Group 2: Financial Implications - Hanmi Semiconductor received a 42 billion KRW (30 million USD) order from SK Hynix for TCB machines, marking its first major supply deal since entering the market in 2020 [2]. - Hanmi Semiconductor has raised TCB machine prices by approximately 25% and started charging for maintenance services, which were previously free, reflecting its dissatisfaction with SK Hynix's supplier diversification [1][2]. Group 3: Market Potential - The TCB machine market is projected to grow significantly, with estimates indicating it will increase from 461 million USD in 2024 to 1.5 billion USD by 2027, driven by the expanding HBM market due to the rise of artificial intelligence [3]. - Securing SK Hynix as a client is seen as pivotal for controlling the global HBM equipment market, highlighting the strategic importance of this competition [3].