国产键合设备再突破，镭神技术慕尼黑上海电子展精彩亮相

Core Viewpoint - The article highlights the advancements made by Raytheon Technology in the semiconductor packaging equipment sector, particularly focusing on their new wire bonding machines that aim to fill the domestic technology gap in this field [1][3][9]. Group 1: Product Innovations - Raytheon Technology showcased upgraded versions of their wire bonding machines at the Munich Shanghai Electronics Show, emphasizing their strong domestic substitution capabilities and technological breakthroughs [1]. - The new products include a module wire bonding machine and a coarse wire bonding machine, designed to cater to the power semiconductor packaging industry, particularly for applications in new energy batteries and IGBT/SiC modules [3][4]. - The module wire bonding machine supports aluminum and copper wire bonding processes, with a welding area of 300mm x 300mm, and is compatible with both single and multi-track automated feeding systems [4]. Group 2: Market Strategy - Unlike many domestic equipment manufacturers, Raytheon Technology focuses on penetrating the underlying technology and key processes rather than competing on price [5]. - The company has developed its own motion control algorithms, image recognition systems, and ultrasonic generators, aiming for a comprehensive domestic replacement of imported equipment [5][7]. - The stability and yield of their coarse wire bonding equipment are reported to be on par with mainstream imported devices, indicating a significant advancement in reliability [7]. Group 3: Industry Context - The power semiconductor packaging sector has historically relied on imported equipment, with domestic market penetration below 5%, presenting a significant opportunity for Raytheon Technology [3]. - The company aims to build trust with clients by leveraging its decade-long experience in optical communication equipment technology and applying it to semiconductor packaging [7][9]. - The article concludes that Raytheon Technology's approach is not about low-cost competition but rather about addressing a long-standing technology gap in the wire bonding field, positioning itself as a leader in domestic equipment innovation [9].