颠覆中介层，玻璃来了！

Core Viewpoint - The article presents a comprehensive analysis of the advantages of glass interposers over silicon interposers in 3D stacking configurations, highlighting significant improvements in area optimization, signal integrity, power integrity, and overall performance metrics [1][4][56]. Group 1: Advantages of Glass Interposers - Glass interposers enable 3D stacking of chiplets embedded within the substrate, a capability not achievable with silicon interposers [1][4]. - Experimental results show that glass interposers can achieve 2.6 times area optimization, 21 times reduction in wire length, a 17.72% decrease in total chip power consumption, a 64.7% improvement in signal integrity, and a 10 times enhancement in power integrity, although temperature increases by 15% [1][4][56]. Group 2: Design and Integration - The study explores the potential of glass interposers in a "5.5D" stacking architecture, which allows for both vertical and horizontal connections between chiplets [6][8]. - The integration of chiplets and interposers is designed to optimize performance, power, and area (PPA), with detailed analysis conducted on signal integrity (SI), power integrity (PI), and thermal integrity (TI) [8][14][56]. Group 3: Manufacturing and Cost Analysis - The manufacturing capabilities of glass interposers allow for large-size panel processing, which is advantageous for high-density wiring similar to silicon interposers [7][8]. - Cost quantification analysis indicates that the glass interposer design can lead to lower manufacturing costs due to its efficient layout and reduced material requirements [8][56]. Group 4: Performance Metrics - The performance comparison of chiplets using different interposer materials shows that glass interposers yield the smallest chip sizes and comparable power consumption across various configurations [24][27]. - Glass interposers demonstrate superior signal and power integrity, with the widest eye diagram and lowest PDN impedance, indicating better performance under operational conditions [46][48][56]. Group 5: Thermal Analysis - Thermal analysis reveals that glass interposers maintain reasonable operating temperatures, with memory chip temperatures slightly higher than other interposer types, but still within acceptable limits [52][56].