半导体芯闻·2025-06-12 10:07Core Viewpoint - The article discusses the evolution and significance of TSMC's CoWoS packaging technology, particularly in relation to NVIDIA's increasing reliance on CoWoS-L for its Blackwell architecture, highlighting the challenges and advancements in the semiconductor industry [1][2][5]. Group 1: TSMC and NVIDIA Collaboration - TSMC has become a crucial partner for NVIDIA, especially in the CoWoS packaging technology, with NVIDIA's CEO stating that they have no alternative to TSMC for this advanced technology [1]. - TSMC has reportedly surpassed ASE Group to become the largest player in the global packaging and testing market, driven by the demand for advanced packaging solutions [1]. Group 2: CoWoS Technology Evolution - NVIDIA plans to increase the use of CoWoS-L packaging for its upcoming Blackwell series products, transitioning from CoWoS-S to meet the high bandwidth requirements of its GPUs [2]. - The CoWoS technology faces challenges due to the increasing chip sizes, which limit the number of chips that can be placed on a 12-inch wafer, and the associated thermal management issues [5]. Group 3: Innovations and Challenges - TSMC is exploring the use of flux-free bonding technology to address issues related to flux residue that can affect chip reliability, with testing expected to be completed by the end of the year [6]. - The current interposer size in TSMC's CoWoS packaging is 80x80mm, with plans to introduce larger sizes by 2026 and 2027, which may enhance performance but also pose design challenges [8]. Group 4: Future Technologies - TSMC is betting on CoPoS technology, which replaces the traditional wafer with a panel, allowing for greater chip density and efficiency, with plans for mass production by 2029 [9][10]. - CoPoS is positioned as a potential alternative to CoWoS-L, offering advantages in signal integrity and power transmission, particularly for high-performance applications [11]. Group 5: Market Implications - The shift from circular wafers to square panels in CoPoS technology is expected to significantly enhance production capacity and cost efficiency, making it competitive in AI, 5G, and high-performance computing sectors [12]. - Despite the advantages, the transition to CoPoS requires substantial investment in materials and equipment, and overcoming technical challenges related to precision and yield will be critical for its success [13].