7月杭州见！2025（第四届）高分子3D打印材料高峰论坛

Core Viewpoint - The 2025 Polymer 3D Printing Materials Summit aims to address the challenges and opportunities in additive manufacturing, particularly in high-end applications such as aerospace, automotive, and biomedical fields, while promoting collaboration across the industry [1][2]. Forum Background - Additive manufacturing technology (3D printing) is recognized for its design flexibility, material efficiency, and customization capabilities, driving advancements in various sectors including aerospace and biomedical [1]. - The integration of "Artificial Intelligence +" is expected to create unprecedented opportunities for industrial upgrades, despite existing challenges in achieving high-volume, low-cost, and high-precision 3D printing [1]. Forum Information - The summit will take place in July 2025 in Hangzhou, Zhejiang, organized by the Polymer Materials and Engineering Branch of the Chinese Materials Research Society [2][3]. - Key figures include Chairpersons from Sichuan University, the Chinese Academy of Sciences, and Zhejiang Normal University [3]. Forum Agenda - The event will span three days, featuring a main forum on opportunities and challenges in additive manufacturing, with specific themes focusing on AI integration, industrial innovations, and biomedical applications [4][6]. - Activities include keynote speeches, technology showcases, and networking opportunities [4]. Core Topics - Key topics include breakthroughs in AI and 3D printing, innovations in industrial applications, and advancements in biomedical 3D printing technologies [6][7]. - Specific areas of focus will cover high-performance polymer materials, multi-material manufacturing, and the integration of AI in additive manufacturing processes [7]. Registration and Fees - Registration fees are set at ¥3000 for regular attendees and ¥1800 for students, with early bird discounts available [9]. - Payment options include bank transfers and online payment methods, with detailed instructions provided for registration [11].