Core Viewpoint - The "2025 Future Semiconductor Industry Innovation Conference" will focus on the integration of diamond and compound semiconductors, addressing key industry challenges and exploring innovative solutions for semiconductor materials and applications [1][3][13]. Group 1: Conference Overview - The conference will be held from May 22 to 24, 2025, at the Hilton Garden Inn in Suzhou, Jiangsu [4][5]. - It aims to create a collaborative platform for academia and industry to promote the integration of diamond technology with other semiconductor technologies [13][22]. Group 2: Key Topics and Discussions - The conference will cover critical topics such as high-power device heat dissipation, substrate preparation, heterogeneous integration, and polishing technology [3][13]. - Discussions will include advancements in diamond semiconductor materials, GaN power devices, and the application of diamond in AI computing chip packaging [18][20]. Group 3: Registration and Participation - Registration fees are set at 2800 yuan per participant and 1500 yuan for students, with discounts available for group registrations [27]. - Participants will receive conference materials, meals, and access to all sessions during the event [27].
倒计时2天！中科院宁波材料所、国创中心、甬江实验室、北大、港大、西交大、哈工大等演讲 聚焦 “金刚石+” 5月22-24日苏州见
材料汇·2025-05-20 15:10