央行：债市“科技板”将重点支持头部股权投资机构

Core Viewpoint - The Chinese government is actively promoting the "Technology Board" in the bond market to support technology-driven companies and venture capital institutions, addressing their unique financing challenges [1][2]. Group 1: Technology Board Initiatives - The "Technology Board" allows issuers to flexibly issue bonds in installments, simplifies information disclosure requirements, and reduces certain issuance and transaction fees [1]. - The initiative primarily supports venture capital institutions, which are crucial for early-stage, small, and hard technology investments, facing challenges such as light assets and long investment cycles [1]. - A risk-sharing tool for technology innovation bonds has been created, with the central bank providing low-cost re-lending funds [1]. Group 2: Market Response and Future Plans - Currently, around 100 institutions are either registered or have issued technology innovation bonds, totaling over 250 billion yuan [2]. - The government aims to closely monitor and continue advancing the "Technology Board," while also improving the supporting mechanisms to enhance its effectiveness [2].