Market Performance - The main board led the gains with notable increases in stocks such as China Great Wall (+7.84%), Tianjin Printech (+5.07%), and Xiang Postal Technology (+4.87%) [1] - The ChiNext board saw significant growth with Aerospace Intelligent Equipment (+8.30%) and Kaleidotech (+6.37%) leading the charge [1] - The Sci-Tech Innovation board was also up, with MediKey (+3.76%) and GeKe Micro (+3.67%) showing strong performance [1] Domestic News - Hon Hai is actively investing in semiconductor packaging and testing, with a recent approval for a $16.93 million investment in Li Ding Semiconductor Technology [1] - Allwinner Technology launched the V821 AI glasses series and V881 visual chip, featuring advanced image processing capabilities [1] - Micron has secured an exclusive outsourcing agreement for HBM2 memory packaging with Taiwan's Licheng Technology, amidst ongoing demand for mature products [1] - ZhiYuan Robotics announced the recruitment of partners for its Lingxi X2 robot, aiming for mass production by the second half of 2025 [1] Company Announcements - Lexin Technology announced a cash dividend of 0.6 yuan per share and a stock increase of 0.4 shares, raising total shares from 112,200,431 to 156,702,722 [3] - Aoto Electronics declared a cash dividend of 0.20 yuan per 10 shares, based on a post-repurchase share count of 649,708,656 [3] - Xichuang Data plans to purchase servers from multiple suppliers, with a total contract value not exceeding 4 billion yuan [3] - Aike Co. reported that its subsidiary received project designation notices from several clients, including BYD and others, for electric drive platform components [3] Overseas News - ACEA reported that European car sales remained stable, with a slight decline of 0.3%, while electric and plug-in hybrid vehicles saw the strongest growth [1] - Singapore's research agency launched the world's first 200mm SiC industrial-grade open R&D production line to address high costs and technical challenges in SiC technology [1] - Canalys reported a 6% year-on-year increase in smartphone shipments in Africa for Q1 2025, reaching 19.4 million units [1] - Samsung plans to introduce glass substrate technology in chip packaging by 2028, aiming to accelerate product development cycles [1]
【太平洋科技-每日观点&资讯】(2025-05-28)
远峰电子·2025-05-27 13:45