【太平洋科技-每日观点&资讯】（2025-05-29）

Market Performance - The main board led the gains with notable increases in stocks such as Yuyin Co. (+10.08%), Chaoxun Communication (+7.09%), and Yongding Co. (+7.03%) [1] - The ChiNext board saw significant growth with New Guodu (+16.30%) and Xiechuang Data (+11.81%) leading the charge [1] - The Sci-Tech Innovation board was also up, with Dekeli (+7.58%) and Qingyue Technology (+7.19%) showing strong performance [1] - Active sub-industries included SW Communication Network Equipment and Devices (+1.94%) and SW Communication Terminals and Accessories (+1.20%) [1] Domestic News - Aibang Semiconductor Network announced a total investment of 1.2 billion, with Hanjin Technology's silicon carbide packaging project reaching completion, capable of producing 300,000 silicon carbide power modules and 50 million silicon carbide power devices annually [1] - TSMC reported a surge in demand for CoWoS chip manufacturing materials, leading to shortages in the memory market, with Mitsubishi Gas Chemical announcing delays in shipments of materials for BT substrates [1] - Changfei Advanced's Wuhan base achieved mass production, with the first 6-inch silicon carbide wafer successfully produced, expected to reach an annual production capacity of 360,000 silicon carbide chips [1] - Anhui Huaxin Micro-Nano Integrated Circuit Co. announced the successful production of the first batch of products from its 8-inch wafer production line, which will have a monthly production capacity of 30,000 wafers [1] Company Announcements - Huajin Technology announced a 2024 annual equity distribution plan, distributing 9 yuan for every 10 shares [3] - Jingyan Technology also announced a 2024 annual equity distribution plan, distributing 1.10 yuan in cash dividends for every 10 shares [3] - Airong Software reported receiving a government subsidy of 7.201 million yuan, accounting for 10.85% of the company's audited net profit for the last fiscal year [3] - Yingfang Micro disclosed a pre-announcement of share reduction by a major shareholder, planning to reduce up to 1% of shares through centralized bidding [3] Overseas News - IBM and Deca Technologies formed a significant alliance in the semiconductor packaging sector, allowing IBM to enter the advanced fan-out wafer-level packaging market [2] - Rohm launched its first high-voltage GaN driver IC, which enhances the stability of GaN devices during high-frequency and high-speed switching [2] - In April, iPhone exports from India to the U.S. increased by 76% year-on-year, while exports from China decreased by 76%, reflecting Apple's accelerated manufacturing plans in India [2] - Samsung is reportedly exiting the MLC NAND flash memory market, notifying customers that orders will only be accepted until June, prompting a search for new suppliers [2]