一文看懂芯片的封装工艺（传统封装篇）

Core Viewpoint - The article provides a detailed overview of the traditional packaging process in semiconductor manufacturing, highlighting the various steps involved and the technologies used in each stage. Group 1: Traditional Packaging Process - The traditional packaging process begins with thinning the wafer, reducing its thickness from 600-800μm to tens to a hundred μm for better heat dissipation and electrical performance [8][9]. - Cutting the wafer involves applying a protective blue film and using advanced techniques like laser cutting, which offers higher precision compared to mechanical cutting [10][11]. - The die attach process connects the die to the substrate using various methods, including adhesive bonding, soldering, and eutectic bonding, with epoxy resin being a common adhesive [13][14][16]. Group 2: Electrical Connection and Testing - Wire bonding is used to establish electrical connections between the die and the substrate, utilizing materials like gold, silver, copper, and aluminum [19][17]. - After bonding, the components undergo cleaning and inspection, often using Automatic Optical Inspection (AOI) for high efficiency and defect detection [21][24][25]. - The final steps include molding, de-flashing, post-mold curing, and final testing to ensure the functionality and quality of the packaged chips before shipping [28][36][37]. Group 3: Packaging Materials and Techniques - Packaging can be categorized into plastic, ceramic, and metal types, with plastic packaging being the most common due to its cost-effectiveness and lightweight properties [28]. - The use of epoxy molding compound (EMC) is prevalent in plastic packaging, providing protection against environmental factors [28]. - The process also includes the application of solder balls for BGA packaging and the use of lead-free plating to meet regulatory standards [33][34].