后摩尔时代的新集成与新材料报告（附17页PPT）

Core Viewpoint - The article discusses the evolution of semiconductor technology, particularly focusing on the transition from traditional SoC (System on Chip) designs to Chiplet architectures, which are expected to extend the economic benefits of Moore's Law in the post-Moore era [4][6][18]. Group 1: Chiplet Technology - Chiplet architecture allows for modular design, enabling flexible customization for specific applications, which can lead to significant performance and cost optimizations [5][7]. - The Chiplet model is anticipated to reduce development cycles and risks associated with chip manufacturing, as seen in AMD's 32-core Chiplet example, which has a total area of 852 mm² compared to a SoC's 777 mm² [5][6]. - Chiplet technology is gaining traction in various fields, including FPGA, CPU, and GPU, with a projected market growth rate (CAGR) of 46% for FPGA and 58% for GPU applications from 2018 to 2025 [10][9]. Group 2: Advanced Packaging Techniques - Advanced packaging technologies such as 2.5D and 3D packaging are critical for the successful implementation of Chiplet architectures, enhancing integration and performance [13][16]. - The industry is focusing on various advanced packaging methods, including Flip-Chip, Wafer Level Packaging, and System in Package (SiP), which improve electrical performance and reduce overall costs [13][16]. - Major players like TSMC, Intel, and Samsung are investing heavily in high-performance packaging as a key direction for the next generation of semiconductor technology [16]. Group 3: SiC Power Semiconductors - Silicon Carbide (SiC) is emerging as a preferred material in the post-Moore era due to its superior performance in high-power and high-frequency applications, particularly in electric vehicles and renewable energy systems [20][22]. - The global SiC power device market is expected to grow significantly, with a CAGR of 42.4% from 2017 to 2021, driven by applications in electric vehicles and industrial automation [28][29]. - SiC devices offer advantages such as higher efficiency, reduced size, and improved thermal performance compared to traditional silicon devices, making them ideal for high-temperature and high-voltage applications [22][27]. Group 4: Market Dynamics and Trends - The SiC power device market is rapidly expanding, with China increasing its market share significantly, indicating a shift in the global supply chain dynamics [28][30]. - The SiC industry is characterized by a strong reliance on substrate suppliers, with a significant portion of the market controlled by foreign companies, highlighting the need for domestic investment and development [30][32]. - The cost structure of SiC devices is heavily influenced by substrate and epitaxy processes, which are critical for maintaining competitive pricing and performance in the market [30][32].