芯和半导体推出多个仿真平台

Core Viewpoint - The article highlights the launch of the EDA2025 software suite by a semiconductor company, which offers a comprehensive "chip-to-system" integrated EDA platform designed to enhance the design of next-generation high-speed and high-frequency smart electronic products [1] Group 1: Product Features - The EDA platform encompasses various multi-physical engine technologies, including SI (Signal Integrity), PI (Power Integrity), electromagnetic, thermal, and stress analysis [1] - It adopts a "simulation-driven design" philosophy, facilitating the design process from chips, packaging, modules, PCB-level, interconnections to complete system integration [1] - The platform supports advanced Chiplet packaging, which is crucial for modern electronic product design [1]