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Core Viewpoint - The article discusses the upcoming "2025 Liquid Cooling Industry Innovation and Application Forum" organized by DT New Materials, highlighting its significance in the liquid cooling technology sector and the participation of various industry leaders [3][10]. Event Details - The forum will take place from July 3 to July 5, 2025, in Dongguan, Guangdong [3][10]. - Over 300 industry professionals are expected to attend, with activities including product displays and report exchanges [3]. Agenda Overview - The event will feature a detailed agenda, including registration, opening activities, keynote speeches, and specialized reports on liquid cooling technologies [4][11]. - Notable topics include future technology trends in liquid cooling, applications of liquid cooling plates for high-power IGBT/SiC chips, and innovations in liquid cooling solutions for data centers [13][20]. Accommodation and Transportation - Various hotel options are available near the venue, with prices ranging from 180 to 350 RMB per night [6][8]. - Transportation details from major airports and train stations to the venue are provided, including estimated costs and travel times [9]. Registration and Fees - Registration fees are set at 2800 RMB for regular attendees and 1200 RMB for students, with on-site fees being slightly higher [32][33]. - Payment methods include bank transfer and Alipay, with specific instructions for registration completion [33].