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【太平洋科技-每日观点&资讯】(2025-07-04)
远峰电子·2025-07-03 11:59

Market Overview - The main board saw significant gains with notable stocks such as Zhongjia Bochuang (+10.11%), Huanrui Shiji (+10.07%), and Yingfangwei (+10.06%) leading the charge [1] - The ChiNext board also performed well, with Yihai New Materials rising by 20.00% and Jiuzhiyang by 15.02% [1] - The Sci-Tech Innovation Board was led by Sanfu Xinke (+9.94%) and Tonglian Precision (+8.27%) [1] - Active sub-industries included SW Printed Circuit Boards (+6.01%) and SW Consumer Electronics Components and Assembly (+4.89%) [1] Domestic News - Chipmaker Chipsea Technology announced that its first high-performance automotive MCU product has recently completed tape-out [1] - Nafor Technology completed a multi-million Pre-A round financing aimed at expanding its high-frequency, high-speed copper-clad laminate production line for aerospace, communications, automotive, and data center applications [1] - Xiamen Silan Microelectronics made significant progress on its 8-inch silicon carbide power device chip manufacturing line, with the first equipment moving in ahead of schedule [1] - China Mobile plans to procure a total of 7,058 AI servers for its AI general computing devices from 2025 to 2026 [1] Company Announcements - Raytheon Technology announced a joint investment to establish a smart glasses company, holding a 35% stake to enhance market competitiveness [2] - Fenghua Advanced Technology declared a cash dividend of 1.50 yuan per 10 shares, totaling approximately 172.12 million yuan [2] - Tonglian Precision announced a similar cash dividend of 1.50 yuan per 10 shares, amounting to about 23.51 million yuan [2] - Zhongwei Company also declared a cash dividend of 0.30 yuan per share, totaling approximately 187.21 million yuan [2] Overseas News - Infineon announced progress in its scalable GaN manufacturing technology, with the first samples expected to be available by Q4 2025 [3] - AGC, a Japanese materials giant, faced supply suspension of a specific CMP polishing liquid due to new export control policies in Taiwan, crucial for advanced chip manufacturing [3] - The Trump administration has lifted some export licensing requirements for EDA software sales to China, promoting technology flow between the two countries [3] - Samsung Electronics reduced its production of HBM3E memory chips due to delays in negotiations and uncertainty in demand for the second half of the year [3]