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Core Viewpoint - The article discusses United Microelectronics Corporation (UMC) actively advancing into high-voltage process technology and its collaboration with Qualcomm and Intel, indicating a strategic shift in the semiconductor industry towards advanced packaging solutions [2][3]. Group 1: UMC's Strategic Moves - UMC is extending its collaboration with Intel from 12nm to 6nm process technology, while also securing significant orders for advanced packaging from Qualcomm for high-performance computing (HPC) [2]. - The company emphasizes advanced packaging as a key development area and is working with subsidiaries and partners to create an advanced packaging ecosystem [3]. Group 2: Advanced Packaging Market Dynamics - UMC's current offerings in advanced packaging are limited to interposers, which contribute minimally to revenue, as TSMC dominates the global advanced packaging market [3]. - The partnership with Qualcomm is expected to open new business opportunities for UMC, potentially disrupting TSMC's exclusive hold on the advanced packaging market [3]. Group 3: Technical Capabilities - UMC possesses the necessary equipment for producing interposers and has previously applied Through-Silicon Via (TSV) technology in GPU chip orders, positioning it well for mass production of advanced packaging [4]. - The first batch of interposers with 1500nF/mm² capacitance has passed Qualcomm's electrical testing, with trial production underway and potential mass production expected by Q1 2026 [3].