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Core Viewpoint - The recent surge in procurement of etching equipment by universities reflects China's accelerated efforts in semiconductor foundational research, talent cultivation, and domestic substitution [2]. Group 1: Procurement Trends - Recent procurement data from July 1 to July 14 indicates a concentrated purchasing activity of etching equipment by various universities, highlighting a strategic move towards enhancing domestic semiconductor capabilities [2]. - Specific procurement announcements from institutions like Fudan University and Tianjin University explicitly state that only domestic products will be accepted, aiming to support local equipment manufacturers [2]. Group 2: Etching Process Overview - Etching is a critical step in semiconductor manufacturing, involving the selective removal of unwanted materials from the silicon wafer surface using chemical or physical methods [2]. - The etching process is categorized into wet etching and dry etching, each serving distinct purposes in the fabrication of semiconductor devices [2]. Group 3: Procurement Details - A detailed table lists various procurement projects, including: - Shenzhen University purchasing an inductively coupled plasma etching system for approximately 950,000 yuan [3]. - Tianjin University acquiring an inductively coupled plasma etching machine for about 1,180,000 yuan [3]. - Harbin Institute of Technology's procurement of a bias-assisted ion etching system for 1,980,000 yuan [3]. - Fudan University’s purchase of a deep silicon etching machine for 4,795,000 yuan [3]. - The procurement activities indicate a significant investment in advanced etching technologies, which are essential for the development of semiconductor devices [3].