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英伟达GB200核心材料揭秘:国产石英布打破日本垄断
材料汇·2025-07-26 15:45

Group 1 - The core viewpoint is that the Low Dk electronic cloth industry chain presents significant investment opportunities due to the increasing demand for high-speed transmission scenarios, particularly in the context of 400G and above switch applications [2][3] - The Low Dk electronic cloth is essential for future high-speed server construction, with its application ratio expected to continuously increase as server transmission demands grow [2][3] - The market for Low Dk electronic cloth is still in a phase of continuous iteration and upgrade, with substantial market expansion potential driven by the increasing transmission rate requirements of downstream data center switches [3][4] Group 2 - The Low Dk electronic cloth industry chain has bright spots across all segments, with a favorable overall competitive landscape due to the complexity of processing and material formulation, resulting in relatively few global suppliers [4][5] - The upstream segment includes high-purity quartz fiberglass as a core material for the third generation of electronic cloth, with companies like Feilihua recommended for investment [4][5] - The midstream segment involves the manufacturing of electronic cloth, with domestic manufacturers like Zhongcai Technology and Honghe Technology expected to expand their production capacity [4][5] - The downstream segment focuses on copper-clad laminate (CCL) manufacturing, with companies like Shenghong Technology and Shenyang Technology anticipated to increase their market share [4][5] Group 3 - The market currently has a high focus on PCB units, often overlooking the upstream electronic cloth supply chain, which is a new category with low current attention [5][6] - The demand for Low Dk electronic cloth is expected to rise in both volume and price, driven by the increasing penetration rate in high-speed switch applications [5][6] - The Low Dk electronic cloth is crucial for meeting the dielectric loss requirements of high-frequency and high-speed copper-clad laminates, particularly for AI servers and other high-performance applications [5][6] Group 4 - The Low Dk electronic cloth industry chain can be divided into three parts: upstream (quartz fiberglass, resin, copper foil), midstream (electronic cloth R&D and manufacturing), and downstream (CCL supply) [31][32] - Upstream, quartz fiberglass is identified as a key positioning material, with its dielectric loss and thermal expansion properties superior to traditional fiberglass [33][34] - The midstream segment requires complex processing techniques for high-purity quartz fiberglass cloth, which significantly impacts the performance of electronic-grade applications [42][43] - The downstream segment is focused on the stringent requirements for PCB processing, particularly for 224G transmission technology, which poses significant challenges for manufacturers [50][51]