HHWW(SH:600172) DT新材料·2025-07-28 02:52Core Viewpoint - The seminar on diamond-based thermal packaging materials and devices aims to address semiconductor cooling challenges and promote innovation in high-performance materials for strategic emerging industries [1][4]. Group 1: Seminar Overview - The seminar titled "'Carbon' Seeking the Future 'Diamond' Breaking Limits" was successfully held in Xuchang, focusing on diamond-based thermal packaging materials [1]. - Nearly 120 participants attended, including government officials, company leaders, and experts from various universities [2]. Group 2: Product Launch - Henan Qianyuan Xindian Semiconductor Technology Co., Ltd., a joint venture between Huanghe Xuanfeng Co., Ltd. and Suzhou Bozhi Jindian Technology Co., Ltd., launched four major product categories: ultra-thin diamond heat sinks, ultra-thin diamond film devices, single/multi-crystal diamond packaging substrates, and modified diamond powder with diamond-copper composite materials [4][9]. - These products aim to accelerate China's positioning in artificial intelligence, new energy, optical communication, and data centers, transitioning from a "follower" to a "leader" in these fields [4]. Group 3: Technological Advancements - Huanghe Xuanfeng has a solid technical foundation in diamond semiconductor materials, particularly high-grade polycrystalline diamonds for high-power heat sinks, which exhibit ultra-high thermal conductivity and excellent semiconductor properties [7]. - The company has initiated a project for developing CVD polycrystalline diamond films aimed at high-end applications, successfully producing 2-inch diameter CVD polycrystalline diamond heat sink materials [10]. Group 4: Research Contributions - Various experts presented research on diamond semiconductors, including topics such as wide bandgap semiconductors, interface control in copper/diamond composites, and applications in high-performance AI chip packaging [8]. - The seminar facilitated collaboration among universities, industries, and financial institutions, fostering consensus in diamond thermal research and development [15]. Group 5: Market Opportunities - Huanghe Xuanfeng is actively engaging with multiple MPCVD equipment manufacturers for potential collaborations in high-end diamond semiconductor equipment production [10]. - The company aims to leverage current market opportunities for comprehensive cooperation in process manufacturing, scientific research transformation, and market expansion [10].