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高频高速树脂的前景分析
DT新材料·2025-07-31 16:05

Core Viewpoint - The rapid development of emerging technologies such as AI, 5G communication, new energy vehicles, and the Internet of Things is driving significant growth in the PCB industry, which in turn is increasing the demand for upstream PCB materials [1][7]. Group 1: Industry Trends - The PCB industry is experiencing high demand due to advancements in AI and communication technologies, leading to increased performance requirements for PCB products [1]. - High-frequency and high-speed copper-clad laminates are essential for applications in base stations, satellite communications, and automotive radar systems [1][4]. - The demand for low dielectric constant (Dk) and low dielectric loss factor (Df) materials is critical for effective signal transmission in high-frequency environments [1][9]. Group 2: Material Types and Applications - Common high-frequency materials include modified epoxy, PTFE, and PCH, each with specific applications in high-frequency and high-speed PCBs [5][6]. - PTFE is preferred for high-frequency substrates due to its superior dielectric properties, especially in applications exceeding 30GHz [3][5]. - High-speed materials focus on minimizing dielectric loss (Df), with applications in computers, servers, and communication electronics [4][6]. Group 3: Future Demand and Supply Chain - The global AI server shipment is expected to grow by 46% in 2024, driven by strong demand from major cloud service providers, which will boost the need for high-frequency and high-speed copper-clad laminates [7][9]. - The supply chain for AI servers is projected to remain stable, with an anticipated growth of nearly 28% in 2025 under basic scenarios [7]. - The shift towards low Dk/Df resin materials is essential to meet the bandwidth and transmission speed requirements of 5G and future 6G technologies [9][10]. Group 4: Environmental and Regulatory Factors - The industry is facing increasing pressure to transition to halogen-free flame retardants due to stringent environmental regulations, which will necessitate significant changes in material formulations [10][10]. - The demand for lightweight and high-performance materials is growing, particularly in the context of miniaturization and integration in consumer electronics [9][10]. Group 5: Upcoming Events and Forums - The "2025 DT New Materials Polymer Industry Annual Conference" will focus on the latest developments in electromagnetic materials, including high-frequency and high-speed PCB substrates [14][15]. - The conference will feature discussions on the integration of new materials in various applications, including 5G/6G communication and new energy vehicles [14][15].