事关脑机接口 七部门发布重磅文件

Core Viewpoint - The article discusses the implementation opinions released by various Chinese government agencies aimed at promoting the innovation and development of the brain-computer interface (BCI) industry, highlighting key technological breakthroughs expected by 2027 and 2030 [1][2]. Summary by Sections Technological Breakthroughs - By 2027, significant breakthroughs in key BCI technologies are anticipated, establishing an advanced technical, industrial, and standard system. The performance of electrodes, chips, and complete products is expected to reach international advanced levels, with applications accelerating in industrial manufacturing, healthcare, and consumer life [2]. Industry Growth - The BCI industry is projected to grow significantly, with the creation of 2 to 3 industrial development clusters and the exploration of new scenarios, models, and business formats. By 2030, the innovation capability of the BCI industry is expected to be significantly enhanced, forming a safe and reliable industrial system [2]. Leading Enterprises - The goal is to cultivate 2 to 3 globally influential leading enterprises and a number of specialized and innovative small and medium-sized enterprises, constructing an internationally competitive industrial ecosystem with comprehensive strength ranking among the world's top [2]. Key Chip Development - The opinions emphasize the need to break through key BCI chips, including the development of high-precision surgical robots for implantable BCIs, high-channel and high-speed brain signal acquisition chips, and ultra-low power consumption brain signal processing chips [3]. Auxiliary Equipment - Development of auxiliary physiological signal devices is highlighted, which will enhance interaction control and sensory assessment accuracy by integrating brain signals with electromyography, electrooculography, electrocardiography, and near-infrared signals [3]. Precision Surgical Robots - The development of high-precision surgical robots for implantable BCIs aims to achieve sub-micron level precision control and dynamic adjustment technology, improving regional precision real-time imaging and three-dimensional reconstruction capabilities [3].