Novoray(SH:688300) 材料汇·2025-08-13 15:49Group 1 - The rapid development of AI is driving the demand for high-end electronic-grade functional fillers, particularly spherical silica and spherical alumina, which are core materials for semiconductor electronic powders [2][12][9] - The performance requirements for PCB and CCL are increasing due to higher standards for AI servers, necessitating the use of Very Low Loss or Ultra Low Loss grade copper-clad laminate materials [3][24][21] - The market for high-performance spherical silica is expected to grow significantly, with its market share in the copper-clad laminate sector exceeding 44% in 2021 and projected to expand further [4][30][28] Group 2 - The HBM (High Bandwidth Memory) market is experiencing rapid growth, with projections indicating a rise from $2.7 billion in 2022 to $37.7 billion by 2029, representing a compound annual growth rate (CAGR) of 38% [5][36][34] - Low-α spherical alumina is a critical material for HBM packaging, helping to mitigate soft errors caused by radioactive impurities [5][33][36] - The increasing demand for HBM is expected to drive the need for Low-α spherical alumina, which constitutes over 80% of the weight in granular epoxy encapsulation materials [5][36][33] Group 3 - The market for functional fillers in high-frequency and high-speed copper-clad laminates is projected to grow from 110 million yuan in 2019 to 1.11 billion yuan by 2025, with a compound annual growth rate of 47% [19][18][19] - The demand for epoxy encapsulation materials is also expected to rise, with projections indicating a market size of 181,000 tons by 2025, reflecting a compound annual growth rate of 11.94% [19][18][19] - The increasing complexity of server platforms is leading to a rise in the number of PCB layers, which in turn is driving the demand for high-performance functional fillers [29][26][29] Group 4 - The company Lianrui New Materials is highlighted as a key player in the market, focusing on high-performance silicon micro-powders and expanding its production capacity to meet growing demand [39][41][40] - The company aims to enhance its product offerings in advanced packaging and high-frequency high-speed copper-clad laminates, with a projected revenue of 960 million yuan in 2024, reflecting a year-on-year growth of 34.94% [41][40][41] - The company plans to issue convertible bonds to fund expansion projects for ultra-pure spherical silica and high-thermal conductivity spherical powder materials [41][40][41]