三星缩减晶圆代工部门招聘规模！

Core Viewpoint - Samsung Electronics is intensifying its recruitment of experienced high-bandwidth memory (HBM) experts to regain leadership in the semiconductor industry, particularly after a weak second quarter, while simultaneously reducing hiring in its underperforming foundry division [1][3]. Group 1: Recruitment Strategy - The recruitment aims to attract senior engineers proficient in next-generation semiconductor and chip packaging technologies, including hybrid bonding technology, which is crucial for enhancing AI and other computing applications [3]. - Samsung's Device Solutions (DS) division plans to hire experienced professionals across six of its nine major business units, including storage chip business, foundry, semiconductor research center, global manufacturing and infrastructure, testing and system packaging, and AI center [3]. - The company will open applications for the second half of the year by August 19, with industry observers expecting a significant increase in recruitment scale, indicating a recovery in the storage chip market [3]. Group 2: HBM Development - Samsung is seeking packaging development experts to design new architectures for advanced HBM, while product planners will communicate with customers interested in customized HBM [3]. - Customized HBM refers to versions of vertically stacked DRAM products with customer-specified functionalities, with Samsung aiming to launch this by 2026 to close the gap with SK Hynix [3]. Group 3: Technology Advancements - Samsung is working on improving hybrid bonding technology, which connects chips directly without using bumps, essential for producing products with 16 or more DRAM layers, reducing stack thickness and heat generation [4]. - The current leading AI memory chip in mass production is the 12-layer HBM3E, while SK Hynix is set to showcase the 16-layer HBM3E chip in early 2025 [4]. Group 4: Business Adjustments - Samsung plans to halt senior recruitment in its system LSI business by the second half of 2025, which is responsible for developing non-storage chip products like Exynos application processors and image sensors, as this division has seen an increase in losses [4]. - Both the foundry and system LSI divisions have been significant factors dragging down Samsung's quarterly performance [4].