9.25-26 苏州见！2025先进封装及热管理大会

Core Viewpoint - The semiconductor industry is transitioning towards the "beyond Moore" era, driven by the increasing demand for efficient thermal management technologies in emerging fields such as 5G, AI, HPC, and data centers [2] Group 1: Conference Overview - The 2025 Advanced Packaging and Thermal Management Conference will focus on high-performance thermal management challenges, featuring three main forums: Advanced Packaging and Heterogeneous Integration Forum, High-Performance Thermal Management Innovation Forum, and Liquid Cooling Technology and Market Application Forum [3][4] - The conference aims to build a platform for industry-academia-research collaboration, promoting technological integration and providing innovative momentum for the semiconductor supply chain [3] Group 2: Conference Details - The conference is organized by Flink Qiming Chain and supported by the National Third Generation Semiconductor Technology Innovation Center (Suzhou) [4] - Scheduled for September 25-26, 2025, in Suzhou, Jiangsu, the conference expects around 500 participants [3] Group 3: Confirmed Speakers - Notable speakers include Professor Liang Jianbo from the National Third Generation Semiconductor Technology Innovation Center, who will discuss high thermal conductivity interface and packaging technology [7] - Other speakers represent various institutions, including the Chinese Academy of Sciences and universities, covering topics such as photothermal polyimide materials and advanced packaging applications [8][9] Group 4: Forum Topics - The forums will address key topics such as advanced packaging technology routes, cost optimization, and challenges in 2.5D/3D integration [17] - The High-Performance Thermal Management Forum will explore thermal interface materials, high-performance chip thermal management solutions, and the impact of Chiplet technology on thermal management [20][21] Group 5: Liquid Cooling Technology - The Liquid Cooling Technology Forum will discuss innovations and challenges in liquid cooling, including the standardization of cooling fluids and the application of immersion cooling in high-power density scenarios [23][24] - Topics will also cover the lifecycle cost analysis of liquid cooling systems and their integration in data centers and electric vehicles [25]