芯擎科技完成新一轮超10亿人民币融资，汪凯：持续拓宽护城河，让更多产品用上更好的「中国芯」

Core Viewpoint - Chip technology company XinQing Technology has successfully completed a B-round financing exceeding 1 billion RMB, indicating strong investor confidence in its technological capabilities and growth prospects [2] Group 1: Financing and Strategic Partnerships - XinQing Technology has secured its first AIC equity project in Hubei and Shandong provinces, along with strategic investment from Taiping Financial Holdings, marking significant progress in multi-dimensional capital collaboration [2] - The company has established a robust investor base from the automotive supply chain and integrated circuit industry, supported by various local governments, creating a collaborative industrial ecosystem [2] Group 2: Market Position and Product Development - In 2024, XinQing Technology is projected to hold the largest market share in domestic smart cockpit chips and is one of the few suppliers capable of covering both smart cockpit and smart driving key SoCs [3] - The company launched the first domestic 7nm automotive-grade smart cockpit chip, "Longying No. 1," which is now used in numerous major vehicle models, including those from FAW Hongqi and Geely [3] - XinQing Technology is set to release the "Xingchen No. 1" high-level assisted driving chip in 2024, which aims to compete with international mainstream products, showcasing improvements in CPU performance, AI computing power, and other key metrics [3] Group 3: Future Growth and Innovation - The company is actively exploring new growth avenues in areas such as embodied intelligence, low-altitude economy, and edge computing, demonstrating strong upward momentum [4] - XinQing Technology plans to increase R&D investment following its recent financing, aiming to expand its competitive edge and enhance the adoption of its products featuring "Chinese chips" [4]