DT新材料·2025-08-19 16:04Core Viewpoint - The article discusses the rising importance of Thermal Interface Materials (TIM) in the context of 5G and upcoming 6G technologies, highlighting their role in managing heat in communication systems as power density increases [1][2]. Group 1: 5G and 6G Development - The construction of global 5G networks is entering a critical phase, with 5G-ADVANCED (5.5G) moving towards commercialization, laying the groundwork for 6G [1]. - As communication speeds increase, the power consumption of base stations will also rise, leading to greater thermal management challenges [1]. Group 2: Importance of Thermal Interface Materials - TIMs serve as "invisible bridges" that fill the micro-gaps between chips and heat sinks, becoming strategic materials essential for the stability of communication systems [1]. - The reduction in the size of base stations necessitates higher integration of antennas and filters, which in turn limits the size of heat sinks, complicating heat dissipation [1]. Group 3: Innovations in Thermal Interface Materials - There are four main categories of innovative TIMs: thermal gels, phase change materials (PCM), carbon-based materials, and liquid metals [2]. - ZTE has implemented a 7.8 W/mK gel solution in its BBU baseband unit, achieving 2 million hours of fault-free operation [2]. - Huawei's use of PCM in its 5G base station RF chips has resulted in a 9.6°C reduction in temperature fluctuations under sudden loads, enhancing output power stability by 40% [2]. Group 4: Future Trends and Events - As 6G terahertz communication pushes chip thermal flux density to the level of 1000 W/cm², TIMs will transition from auxiliary materials to core technologies [2]. - ZTE's wireless thermal design expert will present on the demand and outlook for TIMs in communication base stations at the 2025 Polymer Industry Annual Conference [2].