先进封装：104页详解半导体封装设备（深度报告）

Group 1 - The core role of semiconductor packaging is to achieve electrical connections between chips and external systems, involving multiple processes such as thinning, cutting, mounting, interconnecting, and molding [4][7]. - Packaging technology is categorized into traditional and advanced packaging, with advanced packaging rapidly developing in the post-Moore era, focusing on smaller chip sizes and higher transmission speeds [8][12]. - Advanced packaging techniques include Multi-Chip Packaging (MCP) and System-in-Package (SiP), which allow for stacking multiple chips within a single package [8][12]. Group 2 - The semiconductor packaging equipment market is projected to reach approximately 59.5 billion USD by 2025, with key equipment including die attach machines, dicing machines, and bonding machines [48][49]. - The domestic semiconductor packaging industry is mature, but the localization rate of packaging equipment is less than 5%, indicating a significant opportunity for growth in domestic manufacturing capabilities [50][52]. - Traditional and advanced packaging require overlapping equipment, but advanced packaging demands higher precision and efficiency in processes such as thinning and bonding [53].