Shanghai Allied Industrial (SZ:301419) DT新材料·2025-09-04 16:04Core Viewpoint - The rapid increase in global data traffic driven by technologies such as 5G, artificial intelligence, and cloud computing necessitates the upgrade of data centers to higher speeds like 400G, 800G, and future 1.6T, leading to significant challenges in thermal management due to increased power density and heat generation in optical modules [2]. Group 1: Thermal Management Challenges - The interface thermal resistance is a major bottleneck in the heat dissipation path of optical modules, primarily due to the highly integrated internal structure and minimal distance between heat sources and the casing [3]. - Microscopic surface irregularities and trapped air in gaps create thermal insulation layers, severely affecting heat dissipation and leading to increased chip temperatures, signal degradation, and potential device failure [3]. Group 2: Innovative Solutions by Allied - Allied (stock code: 301419) has introduced the TGEL-SP901, a one-component thermal gel with a thermal conductivity of 9W/(m·K), designed to meet the urgent cooling needs of high-density heat flow applications in optical modules and other high-power electronic devices [5][8]. - The TGEL-SP901 has passed rigorous environmental reliability tests, demonstrating stability in performance after 1000 hours of aging under extreme conditions [7][14]. Group 3: Product Features and Advantages - The TGEL-SP901 offers ultra-high thermal conductivity, effectively addressing heat dissipation challenges for chips exceeding 200W [8]. - It is reliable and durable, showing no oil separation or cracking after extensive aging tests, ensuring long-term reliability throughout the device lifecycle [8]. - The gel's soft and low-stress properties allow it to fill tiny gaps while exerting minimal stress on sensitive components, providing comprehensive protection [8]. - It is compatible with modern automated production lines, featuring excellent dispensing performance without stringing or residue [8][11]. Group 4: Application Scenarios - Typical applications for TGEL-SP901 include high-speed optical modules (400G/800G/1.6T), DSP chip cooling, and laser TOSA cooling [16]. - It also provides overall cooling solutions for 5G front-haul and mid-haul optical modules (25G/50G PAM4) and for co-packaged optics involving silicon photonic chips and driver chips [17][18]. Group 5: Company Background and Expertise - Established in 2004, Allied is a global supplier of communication device components, focusing on R&D, production, and sales, with a commitment to providing advanced thermal management solutions [19]. - The company has successfully applied its thermal materials in various optical module products ranging from 100G to 800G, demonstrating a deep understanding of customer needs and industry pain points [21].