赛墨科技，完成新一轮融资，加码金刚石热管理材料

Group 1 - The core viewpoint of the article highlights the successful completion of a B+ round financing by Semore Technology, aimed at enhancing technology research and expanding product applications in the thermal management materials sector [3][4] - The financing round attracted notable investors including Jiangxi Copper Group, Wenzhou Fangdao Investment, Xichen Capital, and Shenzhen High-tech Investment, indicating strong market interest and confidence in the company's growth potential [4] - The global thermal management market is projected to grow from $56.72 billion in 2023 to $95.64 billion by 2032, with a compound annual growth rate (CAGR) of 6.1% [7] Group 2 - The increasing performance demands of modern electronic devices have led to significant challenges in heat accumulation and dissipation, with research suggesting that future chip heat flow densities may rival that of the sun's surface [5] - Effective thermal management is critical, as studies show that 55% of electronic device failures are due to temperatures exceeding allowable limits, emphasizing the need for advanced thermal materials [5] - Semore Technology focuses on developing lightweight, high thermal conductivity metal matrix composites for applications in high-power chip packaging, 5G communications, and electric vehicles [11] Group 3 - Semore Technology has developed several innovative thermal management solutions, including aluminum-graphite heat sinks, which have doubled the cooling capacity while reducing weight by over 4% [14][15] - The company also produces diamond-copper composite materials, which are seen as a strong solution for high heat flow density electronic device packaging and cooling challenges [8][10] - The company is actively collaborating with major enterprises such as Huawei and other industry leaders to supply advanced thermal materials for various applications, including RF chips and laser radar [18]