国芯网·2025-09-12 14:28Core Viewpoint - The rapid development of AI chips by companies like NVIDIA has led to a surge in demand for advanced packaging services from TSMC, forcing the company to accelerate its production plans significantly [2][4]. Group 1: Market Demand and Production Challenges - TSMC is a leading supplier in advanced packaging technologies such as CoWoS, but it is currently unable to meet the overwhelming market demand on its own [4]. - The company has been compelled to speed up its production processes by more than 75%, and in some cases, by up to a year, deviating from traditional sequential deployment methods [4]. - The product cycles for AI GPU manufacturers like NVIDIA typically range from 6 months to a year, resulting in a sustained high demand for advanced packaging technologies like CoWoS and SoIC [4]. Group 2: Strategic Responses - To address these challenges, TSMC is implementing several forward-looking strategies, including pre-ordering necessary equipment and collaborating with local packaging suppliers [4]. - TSMC has formed a "3DIC Advanced Packaging Manufacturing Alliance," which includes members such as TSMC, ASE, and several other companies, to enhance its production capabilities [4]. - The introduction of NVIDIA's Rubin product line, which will debut six months after the Blackwell Ultra, highlights the need for timely delivery and adaptation to significant architectural differences between product lines [4].