Core Insights - The article discusses the upcoming 2025 Advanced Packaging and HPC Thermal Management Conference, highlighting the industry's shift towards advanced packaging and thermal management technologies due to increasing power density and heat generation in semiconductor applications [3][5][9]. Group 1: Conference Overview - The conference will take place on September 25-26, 2025, in Suzhou, Jiangsu, organized by Flink and supported by various academic and research institutions [3][5]. - The event will feature over 50 keynote speeches and cover critical topics such as Chiplet technology, TGV and glass substrates, panel-level packaging, and advanced thermal management techniques [3][5][7]. Group 2: Agenda Highlights - The agenda includes a series of parallel forums focusing on advanced packaging innovations and high-performance thermal management solutions, with specific sessions dedicated to various technologies and applications [9][10][12]. - Key sessions will address the development trends in high-performance chips, advanced packaging materials, and innovative cooling technologies, including liquid cooling applications [10][17][21]. Group 3: Participant Engagement - The conference aims to facilitate deep dialogue and collaboration between industry, academia, and research sectors, encouraging participants to share their needs and innovations [23][24]. - There will be opportunities for one-on-one VIP matchmaking, product showcases, and a demand release platform to connect supply and demand within the industry [23][24].
议程更新，倒计时15天！400+院校/企业9月齐聚苏州——2025先进封装及高算力热管理大会（9月25-26日）
材料汇·2025-09-13 15:03