BCEIA 2025半导体检测论坛直击：九位专家共议破解产业瓶颈新方案

Core Insights - The article discusses the successful completion of the "Semiconductor Material Testing Technology Forum" held on September 10, 2025, during the BCEIA 2025 event, featuring nine expert speakers who explored various aspects of semiconductor material testing and failure analysis [2][5]. Group 1: Forum Overview - The 21st Beijing Conference & Exhibition on Instrumental Analysis (BCEIA 2025) took place at the China International Exhibition Center, marking the 40th anniversary of BCEIA, with a theme focused on academic exchange and instrument exhibitions [3][34]. - The forum attracted over 300 industry professionals, both online and offline, highlighting the growing interest in semiconductor material testing [5]. Group 2: Key Presentations - Lin Miaoling from the Chinese Academy of Sciences presented on the characterization of in-plane anisotropic semiconductors using angle-resolved Raman spectroscopy, emphasizing the impact of sample thickness and substrate on Raman tensor properties [8]. - Xi Shanbin from the National Semiconductor Device Quality Inspection Center discussed the importance of semiconductor device testing and failure analysis, detailing various testing methods and their significance in product development and quality control [11]. - Ding Xin from HORIBA China showcased the application of optical spectroscopy technologies in semiconductor material characterization, highlighting the importance of high spectral resolution and sensitivity [14]. - Xu Wentao from Suzhou Laboratory discussed the development of testing capabilities for electronic chemicals, focusing on the application of domestic instruments in the semiconductor industry [17]. - Peng Jinlan from the University of Science and Technology of China presented on the development of in-situ silicon nitride thermoelectric chips for scanning electron microscopy, demonstrating their advantages over traditional sample stages [20]. - Hua Younan from Shengke Nano introduced a comprehensive failure analysis method for wafer-level quality control, advocating for the establishment of national standards to enhance quality management in semiconductor manufacturing [23]. - Li Chenhui from Beijing Xinlifang Technology Development Co., Ltd. analyzed the current state and trends of the semiconductor material testing industry from a big data perspective, emphasizing the rapid growth in demand for third-party testing services [26]. - Ma Hongtao from Beijing Software Product Quality Testing and Inspection Center discussed the common failure analysis equipment used in material research, highlighting the interdependence of failure analysis and material characterization [29]. - Ding Yang from the Chinese Academy of Sciences emphasized the critical role of Transmission Electron Microscopy (TEM) and Focused Ion Beam (FIB) technologies in analyzing semiconductor materials and devices, showcasing their applications in various fields [32].