ABF胶膜：半导体封装的“隐形核心”与国产突围战（附投资逻辑）

Group 1 - ABF film (Ajinomoto Build-up Film) is a critical insulating material for semiconductor packaging, essential for high-density interconnection and high-speed transmission in advanced chips [5][7][25] - The global market for ABF films is projected to grow from approximately $471 million in 2023 to $685 million by 2029, driven by demand from high-performance computing, 5G communication, cloud computing, and automotive electronics [43][41] - Japan's Ajinomoto dominates the ABF film market with over 95% market share, creating a significant barrier for new entrants due to its extensive patent network and technical know-how [45][48] Group 2 - The global IC packaging substrate market is expected to reach approximately 96.1 billion yuan in 2024 and grow to 135.03 billion yuan by 2028, with a compound annual growth rate of 8.8% [31][30] - The demand for ABF substrates is primarily driven by high-performance computing, 5G communication, and automotive electronics, which require advanced packaging technologies [28][25] - The competitive landscape for IC packaging substrates shows that Taiwan, Japan, and South Korea dominate the market, with domestic Chinese companies holding a smaller market share [54][61] Group 3 - The ABF film's unique properties, such as low thermal expansion and excellent dielectric performance, make it suitable for high-density wiring and high-frequency applications [23][29] - The technology behind ABF films allows for extremely fine circuit lines, with capabilities of achieving line widths and spacings below 10μm, essential for modern high-performance chips [22][25] - The market for ABF films is expected to expand significantly due to the increasing complexity of chips used in AI, 5G, and automotive applications, which require advanced packaging solutions [43][41]