【财联社早知道】工信部称支持加快车用芯片等技术攻关及产业化，机构表示汽车模拟芯片正进入集中放量阶段，Ta拥有200余款车规级芯片

Group 1 - The Ministry of Industry and Information Technology supports accelerating technological breakthroughs and industrialization of automotive chips, with institutions noting that automotive simulation chips are entering a concentrated release phase. A company has over 200 automotive-grade chips applied in various scenarios such as intelligent cockpits, intelligent driving, intelligent connectivity, vehicle body, chassis, and power systems [1] - Eight departments have issued a document conditionally approving the production access of L3-level vehicles. Institutions claim that the intelligent driving industry has reached a critical point. A company integrates people, vehicles, roads, and clouds, providing a new generation of intelligent connected vehicle solutions covering everything from networked terminals to business platforms and user touchpoints. The company has also independently developed L4-level unmanned electric sightseeing buses [1] - A company is set to release a 1.6T LPO module sample and a 51.2T CPO switch based on commercial scenarios [1]