华为公布未来三年昇腾芯片演进和目标：950PR明年Q1推出

Core Viewpoint - Huawei's rotating chairman Xu Zhijun announced the evolution and goals of the Ascend chip series at the Huawei Connect Conference on September 18, highlighting the company's commitment to advancing its chip technology in the coming years [1] Group 1 - Over the next three years, Huawei has planned multiple Ascend chips, including the 950PR, 950DT, and Ascend 960 and 970 [1] - The 950PR chip is set to be launched in the first quarter of 2026 and will feature Huawei's self-developed HBM (High Bandwidth Memory) [1]