华为徐直军时隔六年再谈芯片进展

Core Viewpoint - Huawei has made significant advancements in self-developed chips, planning to release multiple models in the coming years, emphasizing the importance of computing power for AI development in China [3][5]. Group 1: Chip Development - Huawei plans to launch several Ascend chips, including the 950PR in Q1 2026, utilizing self-developed HBM technology [3]. - The company has introduced the Atlas950 SuperPoD and Atlas960 SuperPoD, which support 8192 and 15488 Ascend cards respectively, showcasing global leadership in key performance metrics [7]. Group 2: AI Infrastructure - The concept of "super nodes" has become a new norm in AI infrastructure, with over 300 Cloud Matrix 384 super nodes deployed [5]. - Huawei's super node and cluster solutions, such as Atlas950 SuperCluster and Atlas960 SuperCluster, exceed 500,000 and 1 million cards in computing scale, respectively [7]. Group 3: Connectivity and Collaboration - Huawei has made breakthroughs in large-scale super node interconnection technology, introducing the UnifiedBus protocol, which will be open-sourced in the future [7]. - The company aims to build a robust foundation for AI computing needs globally, leveraging over 30 years of experience in connectivity technology [8].