华为重磅发布！这款芯片明年一季度推出

Core Insights - Huawei's rotating chairman Xu Zhijun announced the Ascend chip roadmap at the Huawei Connect 2025 conference, planning to launch three series of products: Ascend 950PR/Ascend 950DT, Ascend 960, and Ascend 970 over the next three years [3] - The company emphasizes that computing power is crucial for artificial intelligence and will continue to be a key factor for AI development in China [3] - Huawei aims to meet the growing demand for AI computing power with the planned launches of Ascend chips in 2026 and 2028 [3] Product Launch Timeline - The Ascend 950PR/Ascend 950DT will be launched in Q1 2026, followed by Ascend 960 in Q4 2026, and Ascend 970 in Q4 2028 [3] - In the general computing field, Huawei plans to release Kunpeng 950 and Kunpeng 960, scheduled for Q4 2026 and Q1 2028 respectively [3] Competitive Positioning - Xu acknowledged that due to U.S. sanctions, Huawei cannot produce chips at TSMC, resulting in a performance gap compared to NVIDIA [4] - Despite this, Huawei leverages over 30 years of experience in connectivity technology, achieving breakthroughs that enable ultra-node capabilities [4] - The company expresses a willingness to collaborate with the industry to build a robust foundation for AI computing power both in China and globally [4]