徐直军，最新发声！

Core Viewpoint - Huawei's rotating chairman Xu Zhijun announced that the Ascend chips will evolve at a pace of "almost doubling computing power every year" over the next three years [4][5]. Group 1: Ascend Chip Development - Huawei has planned three series of Ascend chips: Ascend 950, Ascend 960, and Ascend 970, with more specific chips in development [5][6]. - The Ascend 950 series includes Ascend 950PR and Ascend 950DT, featuring significant improvements such as support for low-precision formats, increased vector computing power, and a bandwidth of 2TB/s, which is 2.5 times that of the Ascend 910C [5][7]. - The Ascend 960 is expected to launch in Q4 2027, with specifications that double those of the Ascend 950, including support for a proprietary HiF4 data format [6][7]. - The Ascend 970 is still under discussion, with preliminary plans indicating a doubling of computing power and bandwidth compared to the Ascend 960 [7]. Group 2: Super Nodes and Clusters - Huawei will launch three super node products: Atlas 950, Atlas 960, and TaiShan 950, along with a new interconnect protocol called Lingqu [9][10]. - Xu emphasized that super nodes are becoming the dominant product form for AI infrastructure, functioning as a single logical computer composed of multiple physical machines [9]. - The Atlas 950 SuperCluster will be 2.5 times larger than the current largest cluster, xAI Colossus, and will have 1.3 times its computing power, making it the strongest computing cluster globally [10]. - By Q4 2027, Huawei plans to introduce the Atlas 960 SuperCluster, further increasing the scale to a million card level [10].