华为公布AI芯片路线图！

Core Viewpoint - Huawei announced its product roadmap for the Ascend AI chips, planning to release four new models from 2026 to 2028, with the first model featuring self-developed HBM technology [1][3]. Group 1: Product Roadmap - The roadmap includes the release of Ascend 950PR in Q1 2026, Ascend 950DT in Q4 2026, Ascend 960 in Q4 2027, and Ascend 970 in Q4 2028 [1]. - The Ascend 950PR and 950DT will utilize SIMD/SIMT microarchitecture, achieving performance of 1PFLOPS (FP8) and 2PFLOPS (FP4) respectively [4]. Group 2: Technical Specifications - The Ascend 910C chip has a computing power of 800TFLOPS, with a memory bandwidth of 784GB/s and HBM capacity of 128GB [3]. - In comparison, NVIDIA's latest Blackwell B300 chip has a computing power of approximately 3840TFLOPS and features 288GB HBM3e with a bandwidth of 8TB/s [4]. Group 3: Competitive Landscape - Huawei's chips are designed as NPU (Neural Processing Unit) for AI tasks, contrasting with NVIDIA's general-purpose GPU architecture [3]. - Despite U.S. sanctions limiting Huawei's access to TSMC for chip production, the company claims to leverage over 30 years of experience in interconnecting devices to enhance its computing capabilities [4].