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第二波嘉宾剧透!iTherM2025热管理产业大会(12月3-5日 深圳)
DT新材料·2025-09-18 16:14

Core Viewpoint - The 6th Thermal Management Industry Conference and Exposition (iTherM 2025) will focus on the integration and innovation within the thermal management industry, highlighting the importance of collaboration across various sectors such as electronics, new materials, and green technology [1][2]. Group 1: Conference Information - The conference will take place from December 3 to 5, 2025, at the Shenzhen International Convention and Exhibition Center, with an expected attendance of over 2000 participants and more than 350 exhibitors [1][2]. - The theme of the conference is "Fusion · Innovation | Delivering a Little More," emphasizing the need for synergy in addressing industry challenges and opportunities [1][2]. Group 2: Key Activities and Focus Areas - iTherM 2025 will feature over 20 activities, including keynote speeches, roundtable discussions, and case studies, aimed at fostering communication and collaboration in the thermal management field [2][4]. - The conference will particularly emphasize intellectual property, entrepreneurial projects, and innovative technologies that can transition from laboratories to market applications [4]. Group 3: Featured Companies and Innovations - Notable participants include Henkel, which specializes in thermal interface materials and has applications in electric vehicles and power electronics [5]. - Shenzhen Hongfu Cheng New Materials Co., Ltd. focuses on carbon-based thermal materials for high-speed optical communication and intelligent driving chips [6]. - Shanghai Aled Group Co., Ltd. is expanding its high-performance thermal interface materials for data centers and AI applications [7]. - Other companies like tesa, Chengdu Silica Technology Co., Ltd., and Indium Corporation are also showcasing their advancements in thermal management materials and technologies [8][9][13]. Group 4: Conference Agenda - The agenda includes various specialized forums covering topics such as thermal science, functional materials, technology applications, and engineering solutions [19]. - Specific sessions will address challenges and advancements in data center thermal management, electric vehicle thermal management, and cooling technologies [19]. Group 5: Registration and Participation - Registration fees are set at ¥2200 for regular attendees and ¥1200 for students if paid before October 31, 2025 [21]. - Payment options include bank transfer, Alipay, and WeChat Pay, with specific instructions for invoicing provided [22].