Market Performance - The main board led the gains with notable stocks such as Zhongjia Bochuang (+10.03%), Shenhuafa A (+10.03%), and Landai Technology (+10.00%) [1] - The ChiNext board saw significant increases with stocks like Liandong Technology (+16.15%) and Youkeshu (+8.70%) [1] - The Sci-Tech Innovation board was led by Pinming Technology (+20.00%) and Saiwei Microelectronics (+17.99%) [1] - Active sub-industries included SW Semiconductor Equipment (+0.18%) and SW Education Publishing (+0.10%) [1] Domestic News - Semiconductor Investment Alliance formed a strategic partnership with Suton Juchuang and Kuya Technology, planning to purchase 1.2 million solid-state or digital mechanical lidar units over the next three years for high-end intelligent lawnmower perception system development [1] - BOE announced that its vehicle display base in Vietnam successfully lit its first full-process product and expects to achieve large-scale production by the end of this year, targeting a monthly production capacity of 50,000 modules [1] - Jingsheng Electromechanical announced that its subsidiary, Zhejiang Jingrui SuperSiC, has officially started the trial operation of its first 12-inch silicon carbide substrate processing line, achieving 100% domestic equipment development [1] - Guanshi Technology plans to raise 700 million yuan, with 530 million yuan allocated for photomask manufacturing project construction and 170 million yuan for working capital, indicating a deeper layout in semiconductor key materials [1] Overseas News - Infineon Technologies announced a memorandum of understanding with Rohm to establish a cooperation mechanism for SiC power device packaging, focusing on applications in vehicle chargers, solar power, energy storage systems, and AI data centers [1] - According to SEMI and SEAJ data, global semiconductor manufacturing equipment spending is projected to reach $33.07 billion in Q2 2025, a 23% increase from Q2 2024, with mainland China accounting for the highest spending at $11.36 billion, representing 34% of total spending [1] - Hanmi Semiconductor launched a next-generation tool specifically designed for AI semiconductors, capable of supporting larger chip substrates with a bonding size of up to 75x75 mm [1] - Solidigm announced the launch of a cold plate cooling enterprise-grade SSD designed for fanless server environments, enhancing performance through innovative heat dissipation design [1]
【太平洋科技-每日观点&资讯】（2025-09-29）
远峰电子·2025-09-28 11:30