台积电锁定12英寸碳化硅新战场，布局AI时代散热关键材料

Core Viewpoint - The global semiconductor industry is entering a new era driven by AI and high-performance computing (HPC), with thermal management becoming a critical bottleneck in chip design and manufacturing [2][3]. Group 1: Material Strategy - TSMC is shifting towards 12-inch silicon carbide (SiC) substrates while gradually exiting the gallium nitride (GaN) business, indicating a recalibration of its material strategy [2][4]. - SiC is recognized for its high thermal conductivity, reaching approximately 500 W/mK, significantly surpassing traditional ceramic substrates like alumina or sapphire [2][4]. Group 2: Thermal Management Challenges - The increasing density of applications such as AI accelerators and data center processors is intensifying thermal management challenges, particularly in wearable devices where microchips are closely positioned [3][4]. - TSMC aims to leverage its experience in 12-inch wafer processing to replace traditional ceramic substrates with large-size single-crystal SiC, enhancing yield and cost advantages without needing to rebuild manufacturing systems [3][4]. Group 3: Production and Quality Control - The focus in the industry has shifted from eliminating electrical defects to ensuring uniform density, low porosity, and high surface flatness, which are essential for high-yield production of SiC thermal management substrates [3][4]. - TSMC's existing equipment and packaging capabilities position it well to overcome challenges in slicing, polishing, and flattening SiC substrates, facilitating accelerated mass production [5][6]. Group 4: Application Expansion - TSMC is exploring new applications for SiC beyond power electronics, such as using conductive N-type SiC as thermal diffusion substrates in high-performance processors and AI accelerators [5][6]. - SiC is expected to become a foundational material for thermal management in AI and data center chips, moving beyond its traditional association with power electronics [5][6]. Group 5: Competitive Landscape - Major players like Intel are also recognizing thermal management as a core competitive advantage, as evidenced by their initiatives in backside power delivery and thermal-power co-design [6].