玻璃基板或将成为下一代芯片基板发展趋势

Core Viewpoint - The article emphasizes the growing importance of glass substrates in the semiconductor packaging industry, particularly as the demand for advanced packaging technologies increases due to the evolution of AI computing chips and the limitations of traditional organic substrates [2][4]. Market Overview - The global glass substrate market is projected to grow at a compound annual growth rate (CAGR) of 7.3% from 2024 to 2032, driven by the increasing demand for consumer electronics such as smartphones, tablets, and televisions. The market size is expected to rise from $7.01 billion in 2024 to $12.33 billion by 2032 [5]. - In China, the glass substrate market is also on an upward trend, with a projected growth from 25.2 billion yuan in 2020 to 36.1 billion yuan in 2024, reflecting a CAGR of 9.4% [7]. Competitive Landscape - The glass substrate industry is highly concentrated, with the top three global manufacturers—Corning, AGC, and Nippon Electric Glass—holding a combined market share of 88%. As of 2023, Corning leads with a 48% share, followed by AGC at 23% and Nippon Electric Glass at 17% [10]. - Major manufacturers are facing significant supply constraints in the flat panel display (FPD) glass substrate market by 2025 due to rising energy costs and declining prices, which have pressured profit margins and led to strategic production adjustments [11]. Domestic Developments - Chinese companies are intensifying their research and development efforts in glass substrates to break through the current market dominance of foreign firms. Companies like BOE Technology Group and Wog Technology are focusing on technological innovations and niche applications to close the gap with international leaders [11]. - Notable advancements include BOE's production of the world's first 8.6-generation glass substrate production line and Wog Technology's achievement in TGV (Through Glass Via) technology, which is crucial for high-performance AI chip packaging [12]. Technological Innovations - The article highlights the significance of TGV technology in the glass substrate sector, which allows for finer control over hole dimensions and spacing, essential for advanced semiconductor applications [13][17]. - Various companies, including Corning and Schott, are developing TGV technologies with varying specifications, indicating a competitive landscape focused on enhancing manufacturing capabilities and product quality [13][17].