材料汇·2025-10-17 15:15Core Insights - The global semiconductor market is projected to grow significantly, with estimates suggesting a total market value of $717 billion by 2025, driven by various segments including memory and GPGPU chips [9][10]. Market Growth Projections - The total world semiconductor market is expected to reach $697.184 billion in 2025, reflecting a year-on-year growth of 11.2% from 2024 [5]. - The Americas will see a substantial increase, with projections of $215.309 billion in 2025, marking a 15.4% growth [5]. - The Asia Pacific region is anticipated to grow to $376.273 billion by 2025, with a growth rate of 10.4% [5]. Segment Analysis - The memory market is expected to grow by 20.5% to reach $196.3 billion, with NAND flash and DRAM segments projected at $75.5 billion and $115.6 billion respectively [9]. - GPGPU chips are forecasted to grow by 27%, reaching $51 billion, with HBM expected to increase to $21 billion [9]. - Integrated circuits will dominate the market, projected to reach $600.069 billion in 2025, with a growth rate of 12.3% [5]. Foundry Market Insights - The global foundry market is expected to grow approximately 20%, reaching $170 billion, with TSMC continuing to lead the market [10][13]. - Advanced packaging is projected to grow at a rate of 11%, reaching $69.5 billion by 2029 [14]. Equipment and Material Market - The semiconductor manufacturing equipment market is expected to exceed $1 trillion by 2027, with significant growth in wafer fabrication equipment [19][20]. - The semiconductor materials market is projected to reach $67.7 billion by 2025, with a compound annual growth rate (CAGR) of 4.52% [25]. Regional Developments - China is expected to see a significant increase in 300mm wafer fabs, growing from 29 to 71 by 2027, indicating a strong focus on expanding semiconductor manufacturing capabilities [26]. - TSMC plans to build multiple new fabs globally, including in the U.S., Japan, and Europe, to enhance its production capacity [32][31]. Advanced Packaging and Technology - Advanced packaging technologies, including 2.5D and 3D packaging, are gaining traction, with significant investments in new facilities and technologies [41][54]. - The focus on AI and high-performance computing is driving the demand for advanced packaging solutions, with companies like TSMC and ASE leading the charge [54][41].